Category Archives: Excerpt from the Journal GALVANOTECHNIK

Realisation of regularly faceted three-dimensional metallic mesocrystals by electrodeposition

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Electrodeposition has recently been shown to successfully create three dimensional micro- or nanostructures. Here we demonstrate that highly faceted metallic architectures are readily achieved by appropriate electrodeposition conditions. Three dimensional silver and copper mes-ocrystals with different shapes and size are potentiostatically electrodeposited on highly oriented pyrolytic graphite (HOPG) from simple sulfate and nitrate baths, respectively. The electrodeposition potential plays the most important role in determining the shape and size of mesocrystals. For silver mesocrystals, individual crystals with a range of shapes and sizes are observed which are not influenced by steps in the HOPG substrate. However, when copper is electrodeposited at one distinct potential it tends to form either wires on step edges or particles on terraces. Upon application of a dual pulse potential technique, well defined highly faceted copper mesocrystals are produced.

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Electroless Deposition of Palladium – Part 2

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In Part 1 of this series on the electroless deposition of palladium, the properties of the metal itself were discussed as well as the benefits of the electroless deposition process. In Part 2, the autocatalytic position processes are detailed with an exhaustive review of previously published work in this area.

Link: Electroless Deposition of Palladium – Part 1

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Electroless Deposition of Palladium – Part 1

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Palladium is an interesting element in surface chemistry. It is a noble metal and an active catalyst in many  reactions. Palladium or palladium alloys are used in the fields of catalysts, electronics or hydrogen seperation or purification. One special application is its use as a catalyst for metallising non-conductors like platic materials. In this paper the literature concerning the deposition of catalytic palladium for the surface activation prior to the deposition of electroless nickel and other metals is reviewed.

Link: Electroless Deposition of Palladium – Part 2

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Finite element simulation of nickel electroplating process of a revolving part

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Fig. 2: Electroplated sample

Process simulation and optimization with the help of numerical methods can reduce expensive and time consuming experiments for manufacturing good quality products. Electroplating is a prominent coating process that the quality and uniformity of the deposition are of great importance in this process. In this paper a finite element model has been proposed for evaluation of primary and secondary current density values on the cathode surface in nickel electroplating operation of a revolving part. In addition, the capability of presented electroplating simulation has been investigated in order to describe the electroplated thickness of the nickel sulfate solution. Nickel electroplating experiments have been carried out and the measured thickness in different points have been compared with the predictions. A good agreement between the simulated and experimental results was found. Also the results showed that primary current density can describe the general form of thickness distribution but the relative value of current density using secondary current density can present better description of thickness distribution.

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