Sought-after experts – the Technische Universität Ilmenau (TU Ilmenau) offers a master program in Electrochemistry and Electroplating
Being a small but well-established university located in the centre of Germany, the TU Ilmenau is widely known for its combination of a high standard of training, a convincing campus and a personal atmosphere, thus representing a very pleasant and attractive place of study.
Technische Universität Ilmenau (TU Ilmenau).
One year ago, the university extended its rich and mainly engineering-oriented profile by a new master program in Electro- chemistry and Electroplating (four semesters), behind which there is a whole industry represented by the German Central Association of Surface Engineering (Zentral-verband Oberflächentechnik, ZVO). The master course aims to develop highly qualified professionals as junior staff for the electroplating and surface treatment industry. Continue reading…
The reduction process of nitrate at copper based electrodes was investigated. The cyclic voltammetry (CV) studies allowed us to establish the specific parameters concerning the electrodeposition of the individual metals and their alloys. It was demonstrated that the products resulting from electrochemical nitrate reduction (ENR) in alkaline media can be detected by cyclic hydrodynamic voltammetry (CHV) and square wave voltammetry (SWV) techniques at Cu and CuSn plated Pt electrodes. Moreover, using SWV ammonium can be electrochemically detected with good accuracy. An enhancement of the electrocatalytic activity of Cu by alloying it with Sn was observed. The reduction of nitrate was investigated in an engineering laboratory scale flow reactor under different operating conditions. On the two investigated types of cathode materials (Cu and CuSn), the concentration of nitrate was reduced electrochemically to the maximum permissible limit (50 mg/L) with a energy consumption in the range of 2 – 16 kWh/kg NaNO3 at a CuSn cathode.
Nickel-alumina composite films were obtained by electrocodeposition using different deposition techniques, viz. direct current (DC) deposition and pulse-reverse plating (PRP). Particle incorporation was determined by means of energy-dispersive X-ray spectroscopy and glow discharge optical emission spectrometry (GD-OES). The structure of the films was analyzed using electron microscopy, viz. scanning electron microscopy (SEM), electron backscatter diffraction (EBSD), transmission electron microscopy (TEM), and X-ray diffraction. A <100> fiber texture was found for pure nickel films, which was reduced due to a change in plating conditions and particle incorporation. EBSD mappings indicate that the nanosized particles inhibit nickel growth and thus lead to a smaller nickel crystallite size combined with a distinct loss of the <100> texture. Scanning transmission electron microscopy (STEM) and TEM reveal that the inclusion of alumina nanoparticles preferentially takes place in the grain boundary region where the particles terminate the growth of nickel. High-resolution TEM imaging proves a complete embedding of nanoparticles by the nickel matrix without any voids.